IPA60R250CP coolmos ? power transistor features ? lowest figure-of-merit r on xq g ? ultra low gate charge 6.6 ? extreme dv/dt rated ? high peak current capability ? qualified according to jedec 1) for target applications ? pb-free lead plating; rohs compliant coolmos cp is designed for: ? hard switching smps topologies maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous drain current 2) i d t c =25 c a t c =100 c pulsed drain current 3) i d,pulse t c =25 c avalanche energy, single pulse e as i d =5.2 a, v dd =50 v 345 mj avalanche energy, repetitive t ar 3),4) e ar i d =5.2 a, v dd =50 v avalanche current, repetitive t ar 3),4) i ar a mosfet d v /d t ruggedness d v /d t v ds =0...480 v v/ns gate source voltage v gs static v ac ( f >1 hz) power dissipation p tot t c =25 c w operating and storage temperature t j , t stg c mounting torque m2.5 screws 50 ncm 30 33 -55 ... 150 0.52 5.2 50 20 value 12 8 40 v ds @ t j,max 650 v r ds(on),max @t j = 25c 0.250 ? q g,typ 26 nc product summary type package marking IPA60R250CP pg-to220fp 6r299p type package marking IPA60R250CP pg-to220fp 6r250p pg-to220 fp rev.2. 1 page 1 20 12 -0 1 - 0 9
IPA60R250CP maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous diode forward current 2) i s a diode pulse current 3) i s,pulse 40 reverse diode d v /d t 5) d v /d t 15 v/ns parameter symbol conditions unit min. typ. max. thermal characteristics thermal resistance, junction - case r thjc - - 3.75 k/w r thja leaded - - 80 soldering temperature, wavesoldering only allowed at leads t sold 1.6 mm (0.063 in.) from case for 10 s - - 260 c electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs =0 v, i d =250 a 600 - - v gate threshold voltage v gs(th) v ds = v gs , i d =0, 52 ma 2.5 3 3.5 zero gate voltage drain current i dss v ds =600 v, v gs =0 v, t j =25 c -- 1 a v ds =600 v, v gs =0 v, t j =150 c -1 0- gate-source leakage current i gss v gs =20 v, v ds =0 v - - 100 na drain-source on-state resistance r ds(on) v gs =10 v, i d =7.8 a, t j =25 c - 0.22 0.25 ? v gs =10 v, i d =7.8 a, t j =150 c - 0.59 - gate resistance r g f =1 mhz, open drain - 1.3 - ? value t c =25 c 12 values thermal resistance, junction - ambient rev.2. 1 page 2 20 12 -0 1 - 0 9
IPA60R250CP parameter symbol conditions unit min. typ. max. dynamic characteristics input capacitance c iss - 1300 - pf output capacitance c oss -65- effective output capacitance, energy related 6) c o(er) -55- effective output capacitance, time related 7) c o(tr) - 150 - turn-on delay time t d(on) -40-ns rise time t r -17- turn-off delay time t d(off) - 110 - fall time t f -12- gate charge characteristics gate to source charge q gs -6-nc gate to drain charge q gd -9- gate charge total q g -2635 gate plateau voltage v plateau -5-v reverse diode diode forward voltage v sd v gs =0 v, i f =7.8 a, t j =25 c - 0.9 1.2 v reverse recovery time t rr - 330 - ns reverse recovery charge q rr - 4.5 - c peak reverse recovery current i rrm -27-a 1) j-std20 and jesd22 2) limited only by maximum temperature 3) pulse width t p limited by t j,max 4) repetitive avalanche causes additional power losses that can be calculated as p av = e ar * f. 5) i sd i d , di/dt 200a/s, v dclink =400v, v peak IPA60R250CP 1 power dissipation 2 safe operating area p tot =f( t c ) i d =f( v ds ); t c =25 c; d =0 parameter: t p 3 max. transient thermal impedance 4 typ. output characteristics z thjc =f( t p ) i d =f( v ds ); t j =25 c parameter: d=t p / t parameter: v gs 0 5 10 15 20 25 30 35 0 40 80 120 160 t c [c] p tot [w] 1 s 10 s 100 s 1 ms 10 ms dc 10 3 10 2 10 1 10 0 10 2 10 1 10 0 10 -1 v ds [v] i d [a] single pulse 0.01 0.02 0.05 0.1 0.2 0.5 10 1 10 0 10 -1 10 -2 10 -3 10 -4 10 -5 10 1 10 0 10 -1 10 -2 t p [s] z thjc [k/w] 4.5 v 5 v 5.5 v 6 v 8 v 10v 12 v 20 v 0 15 30 45 60 0 5 10 15 20 v ds [v] i d [a] limited by on-state resistance rev.2. 1 page 4 20 12 -0 1 - 0 9
IPA60R250CP 5 typ. output characteristics 6 typ. drain-source on-state resistance i d =f( v ds ); t j =150 c r ds(on) =f( i d ); t j =150 c parameter: v gs parameter: v gs 7 drain-source on-state resistance 8 typ. transfer characteristics r ds(on) =f( t j ); i d =7.8 a; v gs =10 v i d =f( v gs ); | v ds |>2| i d | r ds(on)max parameter: t j typ 98 % 0 0.2 0.4 0.6 0.8 -60 -20 20 60 100 140 180 t j [c] r ds(on) [ ? ] c 25 c 150 0 10 20 30 40 50 60 0246810 v gs [v] i d [a] 4.5 v 5 v 5.5 v 6 v 8 v 10 v 12 v 20 v 0 5 10 15 20 25 0 5 10 15 20 v ds [v] i d [a] 5 v 5.5 v 6 v 6.5 v 7 v 10 v 0.4 0.6 0.8 1 1.2 1.4 1.6 0 5 10 15 20 25 30 i d [a] r ds(on) [ ? ] rev.2. 1 page 5 20 12 -0 1 - 0 9
IPA60R250CP 9 typ. gate charge 10 forward characteristics of reverse diode v gs =f( q gate ); i d =7.8 a pulsed i f =f( v sd ) parameter: v dd parameter: t j 11 avalanche energy 12 drain-source breakdown voltage e as =f( t j ); i d =5.2 a; v dd =50 v v br(dss) =f( t j ); i d =0.25 ma 25 c 150 c 25 c, 98% 150 c, 98% 10 2 10 1 10 0 10 -1 0 0.5 1 1.5 2 v sd [v] i f [a] 120 v 400 v 0 2 4 6 8 10 0 5 10 15 20 25 30 q gate [nc] v gs [v] 540 580 620 660 700 -60 -20 20 60 100 140 180 t j [c] v br(dss) [v] 0 50 100 150 200 250 300 350 20 60 100 140 180 t j [c] e as [mj] rev.2. 1 page 6 20 12 -0 1 - 0 9
IPA60R250CP 13 typ. capacitances 14 typ. coss stored energy c =f( v ds ); v gs =0 v; f =1 mhz e oss = f (v ds ) 0 2 4 6 8 10 0 100 200 300 400 500 600 v ds [v] e oss [j] ciss coss crss 10 5 10 4 10 3 10 2 10 1 10 0 0 100 200 300 400 500 v ds [v] c [pf] rev.2. 1 page 7 20 12 -0 1 - 0 9
IPA60R250CP definition of diode switching characteristics rev.2. 1 page 8 20 12 -0 1 - 0 9
IPA60R250CP pg-to220-3-31;-3-111: outline/ fully isolated package (2500vac; 1 minute) dimensions in mm/inches rev.2. 1 page 9 20 12 -0 1 - 0 9
IPA60R250CP published by infineon technologies ag 81726 munich, germany ? 2007 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office (www.infineon.com). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. rev.2. 1 page 10 20 12 -0 1 - 0 9
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